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M25SI
Vishay Draloric
120
100
8 0
60
40
20
0
Fusible Thin Film Chip Resistor
100
75
60
45
30
15
0
- 55
- 25
0
25
50
75 100 125 150 175
0
0.1
0.2
0.3
0.4
Deratin g
70 Ambient Temperature in °C
Temperature Rise
Power in W
TEST AND REQUIREMENTS
All tests except the fusing characteristics are carried out in
accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
The tests are carried out in accordance with IEC 60068 (3)
and under standard atmospheric conditions in accordance
with IEC 60068-1, 5.3 (3) . Climatic category LCT/UCT/56
(rated temperature range: Lower category temperature,
upper category temperature; damp heat, long term, 56 days)
is valid.
Unless otherwise specified the following values apply:
Temperature: 15 ° C to 35 ° C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified.
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS
TEST
Endurance test at 70 °C
IEC 60115-1 4.25.1
Endurance at UCT
IEC 60115-1 4.25.3
Thermal shock
IEC 60115-1 4.19, IEC 60068-2-14
Damp heat steady state
IEC 60115-1 4.24, IEC 60068-2-78
Resistance to soldering heat
IEC 60115-1 4.18, IEC 60068-2-58
www.vishay.com
238
CONDITIONS OF TEST
1000 h at 70 °C 1.5 h ON, 0.5 h OFF
1000 h at 125 °C without load
Rapid change between upper and lower
category temperature
56 days at 40 °C and 93 % relative humidity
10 s at 260 °C solder bath temperature
For technical questions, contact: thinfilmchip@vishay.com
PERMISSIBLE
CHANGE ( Δ R)
≤ ±1%
≤ ±1%
≤ ± 0.2 %
≤ ± 0.5 %
≤ ± 0.2 %
Document Number: 20031
Revision: 17-Sep-09
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